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Published: 03 April 2019

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In order to enhance the scientific cooperation with international partners as well as to update the newest researches on signal processing, telecommunications, and computing, faculty of Radio-Electronics Engineering hosted international conference IEEE SigTelCom 2019 (the 3^rd international conference on recent advances in signal processing, telecommunications and computing) on March 21^st– 22^nd, 2019. In the opening ceremony of the conference, Prof. Le Ky Nam, vice president of Le Quy Don Technical University welcomed all scientists attending the conference. He also emphasized that the conference is a good opportunity to widen the cooperation between universities and companies.

SigTelCom is an IEEE conference in which researchers all over the world publish the newest results and discuss cooperation opportunities on signal processing, telecommunications and computing. The main topics of the IEEE SigTelCom 2019 conference are 5G and IoT technologies adapting to industrial revolution 4.0.

There were 61 papers from 22 countries submitted to the SigTelCom 2019 conference. Each paper was blindly reviewed by at least 3 experts. After the careful review process, 38 papers were selected to be presented at the conference and published in the conference proceeding. Especially, at the conference, there were leading professors in the fields of 5G, low-power integrated circuits, and hardware security.

Conference keynote speeches focused on 5G and IoT technologies. Firstly, Prof. Fumiyuki Adachi from Japanese Tohoku University with keynote discussed the evolution of mobile communications networks towards 5th and next generations. Secondly, Prof. Massimo Alioto from Singapore National University introduced the design approaches of low-power integrated circuits. Thirdly, Prof. Lambothanran from Loughborough presented the embedding AI algorithms into telecommunications and wireless sensor networks. Finally, the design of integrated magnetic probes and application for hardware security diagnosis were presented by Prof. Kunihiro Asada from Tokyo University.

There were 60 scientists from 10 countries participated in the conference IEEE SigTelCom 2019. The success of the conference helps scientists in faculty of Radio-Electronics Engineering at Le Quy Don Technical University to update the newest research trends and to open cooperation opportunities with world-leading experts in the fields of 5G and IoT. 

              SigTelCom is an IEEE conference in which researchers over the world publish newest results and discuss cooperation opportunities in signal processing, telecommunications and computing. The main subject of the IEEE SigTelCom 2019 conference is 5G and IoT technologies adapting to industrial revolution 4.0.

There were 61 papers from 22 countries submitted to the SigTelCom 2019 conference. Each paper is blindly reviewed by at least 3 experts. After careful review process, 38 papers are selected to be presented in the conference and published in the conference proceeding. Especially, in the conference there were leading professors in the fields of 5G, low-power integrated circuits and hardware security.

Conference keynote speeches focused on 5G and IoT technologies as  the main subject of the conference. Prof. Fumiyuki Adachi from Japanese Tohoku University with keynote titlled “Wireless Evolution Towards 5G and Beyond” discussed the evolution of mobile communications networks towards 5-th and generations. In another keynote, Prof. Massimo Alioto from Singapore National University introduced design approaches of low-power integrated circuits. Prof. Lambothanran from Loughborough presented embedding AI algorithms into telecommunications and wireless sensor networks. Lastly, design of integrated magnetic probes and application for hardware security diagnosis is presented in the keynote of Prof. Kunihiro Asada from Tokyo Universtiy.  

There are 60 scientists from 10 countries participated in the conference IEEE SigTelCom 2019. The success of the conference helps scientists from faculty of radio-electronics engineering from Le Quy Don Technical University to update newest results and research trends in the fields of 5G and IoT, opening cooperation opportunities with world leading experts in these fields. 

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Published: 23 January 2019

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The 3rd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing
(IEEE SigTelCom2019), March 21st – 22nd, 2019.

The International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (IEEE SigTelCom2019) will be organised at Le Quy Don Technical University, Ha Noi, Vietnam on March 21st-22nd, 2019. SigTelCom 2019 will feature a comprehensive technical programme that spans most state-of-the-art research in all fields of Signal Processing, Telecommunications and Computing. Conference attendees will be hearing from world-class speakers in keynotes and tutorials sessions, as well as presenting their own original technical works. SigTelCom 2019 proceedings will be included in IEEE Xplore.

The focus of SigTelCom2019 will be on Signal Processing, Telecommunications and Computing theory, algorithms, and applications with the theme of “Internet of Things (IoT) and 5G Communications for 4th Industrial Revolution”. Prospective authors are invited to submit their technical paper(s) in the following topics of interest.

Website: http://sigtelcom.net/2019

Submission Link: https://edas.info/newPaper.php?c=24931

Topics include (but are not limited to): 

1. Signal Processing:
Decoding and encoding techniques 
Modulation, coding, and diversity techniques
Signal detection and parameter estimation
Signal, image and video processing
Image Processing and Visualization
Audio, acoustic signal, speech and language processing 
Sensor array, multichannel and communications signal processing
Radar and sonar array signal processing
Estimation theory and applications
Signal processing for education
Bio-inspired modelling and signal processing
Signal processing applications

2. Telecommunications Systems and Networks:

Cooperative communications
Cognitive radio and dynamic spectrum access
Multi-carrier systems, including OFDM
Multiple-input multiple-output techniques
Ultra-wideband & spread spectrum communications
Cellular systems, 2G/2.5G/3G/4G and 5G
WiMAX, LTE, WMAN, and other emerging broadband wireless networks 
Wireless networks for underwater and UAVs communications
Delay tolerant wireless networks
Routing and multicasting protocols
Wireless ad hoc, mesh networks
Sensor Networks and Mobile Sensing
Peer-to-peer wireless networks
Wireless multimedia networks
Optical Networks
Software Defined Networks and Datacenters
Wireless Body Area Network and Wireless Health
Overlay and Programmable Networks
Smart Cities
Services and Support for Smart Cities
Software Defined Smart Objects
Connected Vehicles
Green communications and energy efficiency
Next Generation Networks Infrastructures and Management
Distributed Systems Architecture and Management
Network Reliability, Quality of Service and Quality of Experience
Standardization activities of emerging technologies
Medium access techniques and protocols for telecommunication networks
Security, Cryptography and Privacy
Network Design, Optimisation and Management
Network planning, capacity analysis & topology control
Network measurement, validation and verification
Testbeds and deployment

3. Computing Technologies:
Blockchain technology
High-performance computing
Grid computing
Cloud computing
Green computing
Ubiquitous computing
Peer-to-peer and cluster computing
Software engineering 
Artificial Intelligent Systems applications
Human Language Technologies
Knowledge discovery and data mining
Mobile learning applications
Mobile development applications
Pervasive and wearable computing
Web-based computing and services
Wireless and mobile computing
Multimedia computing applications & architectures
Security and trusted computing
Computing operating systems
Social Networks, Crowd sourcing & Crowd sensing

4. Electronics and Control Systems:

Devices, circuits and systems
Internet of Things (IoT) systems
Smart environment monitoring systems
Power electronics and energy systems
Air and water pollution management and control
Advanced embedded systems
Emerging IC technologies
Monitoring and control of structures
Consumer and automotive electronics
Networked control systems
Automation, robotics and control
Dynamics, vibration and control
Intelligent transportation systems

* Conference Organization Committees
__________________________
Honorary General Chairs
Cong-Dinh Nguyen, President of Le Quy Don Technical University, Vietnam
Le Cong Co, President of Duy Tan University, Vietnam
Doan Quang Hoan, The Authority of Radio Frequency Management, Vietnam 
__________________________
General Chairs
Trung Q. Duong, Queen’s University Belfast, UK
Xuan-Nam Tran, Le Quy Don Technical University, Vietnam
Dac-Binh Ha, Duy Tan University, Vietnam
__________________________
Technical Program Chairs 
George K. Karagiannidis, Aristotle University of Thessaloniki, Greece 
Vo Nguyen Quoc Bao, Posts and Telecommunications Institute of Technology, Vietnam
Van-Phuc Hoang, Le Quy Don Technical University, Vietnam

Track Chairs
General Track
Co-Chairs:
Yonghui Li, University of Sydney, Australia 
Berk Canberk, Northeastern University, USA 
Kyeongjin Kim, MERL, USA
Ta Chi Hieu, Le Quy Don Technical University, Vietnam

Computing Technologies Track
Co-Chairs: 
Jonas Nan Yang, Australian National University, Australia
A. Nallanathan, Queen Mary, University of London, UK 
Van-Tam Nguyen, Institute of Applied Technology (Intek), Vietnam
Anand Nayyar, Duy Tan University, Vietnam

Communication Theory Track
Co-Chairs: 
Le-Hung Nguyen, Da Nang University, Vietnam 
Ha H. Nguyen, University of Saskatchewan, Canada 
Malcolm Egan, University of Lyon, France
Marco Di Renzo, SUPELEC, and the University of Paris–Sud XI, Paris, France

Fixed and Wireless Networks Track
Co-Chairs: 
Kai-Kit Wong, University College London, UK 
Duy H. H. Nguyen, University of Texas at Austin, USA
Huu Thanh Nguyen, Hanoi University of Science and Technology, Vietnam
Tan-Hung Nguyen, Da Nang University, Vietnam

Signal Processing Track
Co-Chairs: 
Guanghao Sun, The University of Electro-Communications, Japan
Hien Quoc Ngo, Queen’s University Belfast, UK 
Zoran Hadzi-Velkov, Ss. Cyril and Methodius University, Macedonia
Linh-Trung Nguyen, Vietnam National University, Vietnam

Emerging Areas in Wireless Communications 
Co-Chairs: 
Oh-Soon Shin, Soongsil University, Korea
Quoc Tuan Vien, Middlesex University, UK
Nghi H. Tran, University of Akron, USA
Daniel Benevides da Costa, Federal University of Ceará, Brazil

Electronics and Control Systems 
Co-Chairs: 
Hoa Le Minh, Northumbria University, UK 
Lei Shu, Guangdong University of Petrochemical Technology, China
Wei Liu, University of Sheffield, UK
Truong-Son Nguyen, Le Quy Don Technical University, Vietnam

VLSI Systems and Hardware Security
Co-Chairs: 
Cong-Kha Pham, The University of Electro-Communications, Japan 
Junqing Zhang, University of Liverpool, UK
Dac-Binh Ha, Duy Tan University, Vietnam
Xuan-Tu Tran, VNU University of Engineering and Technology, Vietnam

Intelligent Systems 
Co-Chairs: 
Daniel Ka Chun So, University of Manchester, UK
Shui Yu, Deakin University, Australia
Bui Thu Lam, Le Quy Don Technical University, Vietnam 
Huynh Thi Thanh Binh, Hanoi University of Science and Technology, Vietnam

__________________________
Publication Chair
Vo Nguyen Son, Duy Tan University, Vietnam
__________________________
Regional Publicity Chairs
Quoc Dinh Nguyen, Le Quy Don Technical University, Vietnam
Do Thanh Quan, Le Quy Don Technical University, Vietnam
Luong Duy Manh, Le Quy Don Technical University, Vietnam
__________________________
International Publicity Chairs
Koichiro Ishibashi, The University of Electro-Communications, Japan
Massimo Alioto, National University of Singapore, Singapore
Tomohiko Taniguchi, Fujitsu Laboratories, Japan
Jaime Lloret Mauri, Universidad Politécnica de Valencia, Spain
Al-Sakib Khan Pathan, Southeast University, Bangladesh
Yuan-Fang Chen, Institute Mines-Telecom & University Pierre and Marie CURIE, France
__________________________
Local Organization Chairs
Quang Nguyen-The, Le Quy Don Technical University, Vietnam
Hung Le Tien, Le Quy Don Technical University, Vietnam
Trinh Quang Kien, Le Quy Don Technical University, Vietnam

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Published: 12 May 2018

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Chiều 09/5, theo lời mời của Khoa Vô tuyến Điện tử, Giáo sư Koichiro Ishibashi, Giám đốc trung nghiên cứu của Đại học Điện-Thông tin Tokyo tại ASEAN, trưởng phòng nghiên cứu về Internet vạn vật (IoT) của trường đã đến làm việc và trao đổi nội dung hợp tác nghiên cứu khoa học với Khoa. Về phía Học viện có Đại tá Tạ Chí Hiếu –  Bí thư Đảng ủy, Phó chủ nhiệm Khoa, Đại tá Trần Xuân Nam, Trưởng phòng Đào tạo và các đồng chí cán bộ, giáo viên trong Khoa đang thực hiện nội dung hợp tác nghiên cứu với Đại học Điện-Thông tin Tokyo.

Với trên 30 năm nghiên cứu, GS Ishibashi đã công bố trên 110 bài báo tại các tạp chí và hội thảo quốc tế hàng đầu trong lĩnh vực Internet của vạn vật và vi mạch-bán dẫn, 03 cuốn sách và nhiều giải thưởng khoa học uy tín.

Trong buổi làm việc, GS Koichiro Ishibashi đã thảo luận các nội dung hợp tác giữa hai bên theo cam kết hợp tác đã kí giữa hai trường. Các chủ đề của nội dung trao đổi gồm có nghiên cứu thiết kế hệ thống giám sát thông minh trên nền tảng Internet của vạn vật (IoT), thiết kế chế tạo thiết bị giám sát bệnh nhân và chẩn đoán bệnh tự động, kỹ thuật thu thập năng lượng song vô tuyến, kế hoạch tổ chức hội thảo tại Học viện và cơ hội cử giáo viên tham gia học nghiên cứu sinh và thực tập ngắn hạn tại Đại học Điện-Thông tin Tokyo.

Buổi làm việc thành công tốt đẹp, hứa hẹn mở ra nhiều cơ hội hợp tác cụ thể và hiệu quả trong thời gian tới, góp phần nâng cao năng lực của Khoa trong việc đáp ứng đòi hỏi của cuộc cách mạng công nghiệp 4.0.

Hoàng Văn Phúc – K31

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Published: 20 March 2018

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Hiện tại, ngoài chương trình Tuyển dụng sinh viên học bổng STP và tuyển dụng các bạn sinh viên tốt nghiệp Cao đẳng cho vị trí Kiểm thử phần mềm.

SVMC đã tuyển dụng các bạn sinh viên đã và sẽ tốt nghiệp năm 2018. Thông tin chi tiết có trong file ảnh đính kèm dưới đây.